IPC-2581 Consortium @ IPC APEX Show 2014

Consortium Members Receiving Awards from IPC of Their Contribution to IPC Standards


       

  Gary Carter, Fujitsu                    Chris Shaw, Fujitsu                      Humair  Mandavia, Zuken

       

 Ed Acheson, Cadence                Mike Buetow, UP Media              Terry Hoffman, Cisco


PCB Designer Council: Enabling Efficient, Collaborative Design with IPC-2581

Presenter: Gary Carter, Senior Manager of CAD Engineering, Fujitsu Network Communications 









It was a very well attended session with about 50 attendees. Gary Carter from Fujitsu Network Communications presented an introduction to IPC-2581, detailed introduction on the schema for IPC-2581, introduced the consortium and also provided an update on IPC-2581 adoption in the industry. He explained how the current process of using multiple files is error prone and requires careful attention by the designers as well as the manufacturing partner. In the industry adoption section, Gary talked about his experience of fabricating 12 layer PCBs through three partners – Sierra Circuits, Sanmina-SCI and TTM-OPC. Presentation concluded with Gary encouraging everyone in the audience to get involved either through a corporate membership or through an individual associate membership in the IPC-2581 consortium and help accelerate adoption of the new, open, neutral, modern standard (IPC-2581) to transfer design data to manufacturing. 

 

IPC-2581 Standards Working committee: Product Data Description (Laminar View) Sub Committee

Presenter: Chris Shaw, Fujitsu Network Communications

 The Product Data Description (Laminar View) Subcommittee (2-16) meeting, more affectionately known as the IPC-2581 standards committee, met in the afternoon of Day1- Monday, March 24th. There was a very good representation of industry leaders in the meeting. The committee spent 6 hours discussing the B revision of IPC-2581 (introduced in August 2013) to identify areas where new features  can best be leveraged as well as clarification on some issues defined in the new specification. Discussion surrounding the Stack-up exchanges between tools such as Polar Instruments Speed stack, and Cadence Allegro were reviewed,  and to the detail of transmitting design intent from concept to manufacturing. through the new SPEC model, where detailed fabrication or assembly notes could be defined within the 2581 file, and linked to specific design elements or components in the design. Chris Shaw of Fujitsu has made several proposals to make better use of the new features, and even offered a method of simplifying the data export while maintaining links within the IPC-2581 data.  Discussion will continue later in June at a work session to identify more ways to leverage this format, and plan for the future of data inclusion into IPC-2581.

 

Design Buzz Session on IPC-2581 RevB

Presenter: Fujitsu, Cadence, Polar Instruments, Sanmina

  • Gary Carter, Fujitsu: Introduction of IPC-2581
  • Ed Acheson, Cadence: What's new in IPC-2581
  • Cheryl Prochaska, Polar Instruments: Stack up exchange using IPC-2581 by RevB
  • Ed Acheson, Cadence: Validation approaches
  • Gary Carter, Fujitsu; Larry Frost, Sanmina: Update on Industry Adoption of IPC-2581


Panel Discussion: War of Manufacturing formats – Gerber, ODB++ & IPC-2581      

Panelists: Ucamco (Representing Gerber+), Mentor (Representing ODB++), Cadence (Representing IPC-2581)

I-Connect007 hosted a round table panel discussion recently about merits of various PCB design file transfer formats,  Hemant Shah from Cadence Design Systems (representin IPC-2581 Consortium), Karel Taveriner from Ucamco (talking about Gerber) and David Wiens from Mentor Graphics (talking about ODB++) joined the discussion. Panel discussion was moderated by Ben Jordan from Altium. Gerber, ODB++ and IPC-2581, they all have their strengths, so which one should you choose?   Click here to view the video of this panel discussion