IPC-2581 RevB is released!
After 12 months of development and validation, the IPC-2581 RevB was announced and published by IPC recently. "I've never seen an IPC standard move that fast," said Gary Carter, Senior Manager of CAD Engineering at Fujitsu Network Communications, "It's a great example of what can be accomplished when people from the industry align on and work towards a common goal!"
Significant features in the IPC-2581 RevB include the following:
- Ability to define "build intent" through stack ordering, material types, technology attributes, and stackup composites
- Expanded bill of materials (BOM) section to include stackup
- Geometry object fill types, line types, user-defined primitives
- Back drilling support
- Pin one, origin/orientation standard criteria, and pick-up point for packages
- Pad stack reference definitions
- Z-axis definition, V-groove cavity/slot report
- Ability to add more notes on design intent
The PDF version of the standard is free to download now on the IPC website.
With help from the consortium, IPC recently released IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology. It was completed in a short 12-month timeframe. That quick cycle underscores the high level of interest that brought together companies from throughout the supply chain. Here is an article from Terry Costlow, editor from IPC, talking about the efforts from the industry to move IPC-2581B into production.
IPC-2581 Consortium participated 2013 PCB Carolina at the McKimmon Center on the NC State University campus on October 23rd, in order to spread the organization's message and to accelerate the adoption of IPC-2581 as an open, neutrally maintained global standard data transfer format and to encourage innovation, improve efficiency and reduce costs. Hemant Shah, Marketing Director from Cadence Design Systems delivered a presentation named "Electronics Data Transfer Today: A Status Update on IPC-2581" at the show. This talk provided an update on the consortium activities on accelerating adoption, as well as the details of the latest version of IPC-2581B.
Hemant Shah, product marketing director at Cadence, and Gary Carter, manager of CAD engineering at Fujitsu Network Communications, provided an update of the momentum that IPC-2581 Consortium made in the past one year at PCB West 2013. Two new boards were recently fabricated using IPC-2581 by Sanmina and Sierra Circuits respectively. Also, a "Rev B" standard with many improvements was completed from start to finish in 12 months.